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Metal bonding wire is one of the key materials for semiconductor packaging. Its function is to realize the electrical connection between semiconductor chip and pin, and it plays the role of current import and export between chip and outside. At present, bonding wire is mainly composed of gold wire, copper wire, aluminum wire, silver wire, noble/base metal composite material, which is widely used in COB semiconductor chip packaging, IGBT power semiconductor devices, memory chips, mobile phone CCM module, LED light-emitting = diode and other electronic components packaging.